User manual 3M ELECTRONIC EQUIPMENT ASSEMBLY

[. . . ] Application Profile Market: Electronic Account Type: Electronic Equipment Assembly 3MTM Z-Axis Adhesive Film 5303R adheres and provides an interconnection of the flexible printed circuit to the printed circuit board. Application Description 3M Z-Axis Adhesive Film 5303R represents an alternative to many lead-based interconnections systems such as solder. Electrically connects and mechanically bonds flexible printed circuit--including TAB (Tape Automated Bonding) circuits--to a variety of electronic substrates and metallizations, including printed circuit boards, glass substrates (LCD displays) and flex circuits. TM PRODUCT 3MTM Z-Axis Adhesive Film 5303R REGION North America Application Method Heat and pressure bond using hot bar bonder. APPLICATION TYPE Bonding Flexible Printed Circuit Key Application Requirements Fine pitch interconnect. SIC 3679 ­ Electronic Components 3672 ­ Printed Circuit Board Benefits/Advantages To Customer Fine pitch interconnection: Bonds to pads as small as 100 mil²; pitch as fine as 5. 5 mils. [. . . ] 3MTM Z-Axis Adhesive Film 5303R is available in 1 mil and 2 mil adhesive thickness on standard 3 millimeter x 10 meter or 50 meter length spools, or can be purchased as 10 cm x 15 cm sheets. The adhesive film is supplied on a cleanroom compatible poly release liner for easy handling and is provided via plastic reel. Electrical interconnection is made by contact between conductive particles in the adhesive (0. 5 mil diameter or smaller) and circuit lines on the substrates. During the heat bonding operation (which cures and crosslinks the adhesive), pressure is applied and maintained until the system is cooled. As the temperature declines, the adhesive contracts to a greater degree than the particles. The circuits are pulled together against the particles and held there. The adhesive provides a permanent, high reliability bond. Low electrical resistance bonds capable of withstanding most burn-in and thermal cycle tests, including -55º C/125º C (-67ºF/257ºF) thermal cycling or 85º C (185ºF)/85% relative humidity aging for 1000 hours with less than 10 milliohms change in contact resistance. Repairability can be achieved by application of heat to separate the circuits followed by solvent clean-up of the site. Product 3MTM 5303R Z-Axis Adhesive Film Advantages For many fine pitch applications. Low electrical resistance (milliohms) Note: 3M Z-Axis Adhesive Film 5303R is provided on plastic reels and must be stored in freezer below 0° C (32° F) to maintain shelf life. Key Decision Makers Design Engineers, Production Engineers For Additional Information To request additional product information or to arrange for sales assistance, call 1-800-362-3550. Address correspondence to: 3M Bonding Systems Division, 3M Center, Building 220-7E-01, St. 3M MAKES NO WARRANTIES, EXPRESS OR IMPLIED, INCLUDING, BUT NOT LIMITED TO, ANY IMPLIED WARRANTY OF MERCHANTABILITY OR FITNESS FOR A PARTICULAR PURPOSE. [. . . ] 3M shall not otherwise be liable for loss or damages, whether direct, indirect, special, incidental, or consequential, regardless of the legal theory asserted, including negligence, warranty, or strict liability. Important Notice Limitation of Remedies and Liability Bonding Systems Division 3M Center, Building 220-7E-01 St. Paul, MN 55144-1000 Printed in USA Eea5303R. qxd © 3M 1999 [. . . ]