User manual KINGSTON KHX2333C9D3T1K2-4GX MEMORY MODULE SPECIFICATION

[. . . ] TECHNOLOGY Memory Module Specification KHX2333C9D3T1K2/4GX 4GB (2GB 256M x 64-Bit x 2 pcs. ) DDR3-2333MHz CL9 240-Pin DIMM Kit DESCRIPTION: Kingston's KHX2333C9D3T1K2/4GX is a kit of two 256M x 64-bit (2GB) DDR3-2333MHz CL9 SDRAM (Synchronous DRAM) memory modules, based on sixteen 128M x 8-bit DDR3 FBGA components per module. [. . . ] The SPDs are programmed to JEDEC standard latency DDR3-1333MHz timing of 9-9-9 at 1. 5V. Each 240-pin DIMM uses gold contact fingers and requires +1. 5V. The JEDEC standard electrical and mechanical specifications are as follows: FEATURES: JEDEC standard 1. 5V ± 0. 075V Power Supply VDDQ = 1. 5V ± 0. 075V d ye 667MHz fCK for 1333Mb/sec/pin Ke d ye Ke 8 independent internal bank d ye Ke Programmable CAS Latency: 6, 7, 8, 9 Posted CAS Programmable Additive Latency: 0, CL - 2, or CL - 1 clock Programmable CAS Write Latency(CWL) = 7(DDR3-1333) 8-bit pre-fetch Burst Length: 8 (Interleave without any limit, sequential with starting address "000" only), 4 with tCCD = 4 which does not allow seamless read or write [either on the fly using A12 or MRS] Bi-directional Differential Data Strobe Internal(self) calibration : Internal self calibration through ZQ pin (RZQ : 240 ohm ± 1%) On Die Termination using ODT pin Average Refresh Period 7. 8us at lower then TCASE 85°C, 3. 9us at 85°C < TCASE . 95°C Asynchronous Reset PCB : Height 2. 401" (61. 00mm) w/ heatsink, double sided component PERFORMANCE: CL(IDD) Row Cycle Time (tRCmin) Refresh to Active/Refresh Command Time (tRFCmin) Row Active Time (tRASmin) Power UL Rating Operating Temperature Storage Temperature 9 cycles 49. 5ns (min. ) 110ns 36ns (min. ) 1. 800 W (operating per module) 94 V - 0 0o C to 85o C -55o C to +100o C Document No. [. . . ] 4805702-001. A00 07/22/10 Page 1 ValueRAM MODULE DIMENSIONS: TECHNOLOGY 30. 00 Units: millimeters 133. 35 18. 80 15. 80 11. 00 8. 00 0. 00 0. 00 54. 70 w/ heatsink assembly mm 61 01 2. 4 Document No. [. . . ]