User manual SAGEM HILO 3G ANNEXE 1

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Manual abstract: user guide SAGEM HILO 3GANNEXE 1

Detailed instructions for use are in the User's Guide.

[. . . ] MECHANICAL SPECIFICATION. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38 8. 1 PHYSICAL DIMENSIONS. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38 8. 2 ASSEMBLY . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40 8. 3 TERMINAL ASSIGNMENTS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42 8. 3. 1 Board to Board connection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42 8. 3. 2 Antenna connection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43 9. Smart cards; UICC-Terminal interface; 102230 Physical, electrical and logical test specification 3GPP TS 51. 010-4 : Mobile Station (MS) conformance specification; Part 4: Subscriber STK: 3GPP TS 51. 010-4 Identity Module (SIM) application toolkit conformance test specification 3GPP TS 31. 124 : Mobile Equipment (ME) conformance test specification; Universal USAT:3GPP TS 31. 124 Subscriber Interface Module Application Toolkit (USAT) conformance test specification Note d'étude / Technical document : URD1­ OTL 5696. 1­ 004 / 72362 Edition 06 HILO 3G TECHNICAL SPECIFICATION 29/09/2011 - page 6/46 CE ­ only for HiLo3G-900 variant RF: 2G EN301511 (refer to PTCRB/GCF RF report) RF: 3GEN301908-2 (refer to PTCRB/GCF RF report) ETSI EN 301 511 Global System for Mobile Communications (GSM); Harmonized EN for Mobile Stations in the GSM 900 and GSM 1800 Bands Covering Essential Requirements Under Article 3. 2 of the R&TTE Directive (1999/5/EC) ETSI EN 301 908-2 Electromagnetic compatibility and Radio spectrum Matters (ERM); Base Stations (BS), Repeaters and User Equipment (UE) for IMT-2000 ThirdGeneration cellular networks; Part 2: Harmonized EN for IMT-2000, CDMA Direct Spread (UTRA FDD) (UE) covering essential requirements of article 3. 2 of the R&TTE Directive EN 301908-1 Electromagnetic compatibility and Radio spectrum Matters (ERM) - Base Stations (BS), Repeaters and User Equipment (UE) for IMT-2000 Third-Generation cellular networks Part 1: Harmonized EN for IMT-2000, introduction and common requirements, covering essential requirements of article 3. 2 of the R&T ETSI EN 301 489-1 Electromagnetic compatibility and Radio spectrum Matters (ERM); ElectroMagnetic Compatibility (EMC) standard for radio equipment and services; Part 1: Common technical requirements ETSI EN 301 489-7 ElectroMagnetic Compatibility and Radio Spectrum Matters (ERM); ElectroMagnetic Compatibility (EMC) Standard for Radio Equipment and Services; Part 7: Specific Conditions for Mobile and Portable Radio and Ancillary Equipment of Digital Cellular Radio Telecommunications Systems (GSM and DCS) ETSI EN 301 489-24 Electromagnetic Compatibility and Radio Spectrum Matters (ERM); ElectroMagnetic Compatibility (EMC) Standard for Radio Equipment and Services; Part 24: Specific Conditions for IMT-2000 CDMA Direct Spread (UTRA) for Mobile and Portable (UE) Radio and Ancillary Equipment SAR (MPE) : EN62311 Safety: EN60950-1 EN 62311:2008 Assessment of electronic and electrical equipment related to human exposure restrictions for electromagnetic fields (0 Hz - 300 GHz) EN60950-1: Information technology equipment. General requirements RF: 3G EN301908-1 EMC: EN301489-1, -7, 24 FCC RF : FCC Part 22H (850 FCC Part 22 Subpart H: Cellular Radiotelephone Service; MHz Band ) Subpart I: Offshore Radiotelephone Service; FCC Part 24E (for 1900 MHz Band) FCC Part 24 E: Personal Communications Service;Subpart E: Broadband PCS. EMI: FCC Part 15B SAR (MPE) : OET65C Subpart B - Radio frequency devices subpart B ­ Unintentional Radiators Note d'étude / Technical document : URD1­ OTL 5696. 1­ 004 / 72362 Edition 06 HILO 3G TECHNICAL SPECIFICATION 29/09/2011 - page 7/46 IC RF 2G : RSS-132 RF 3G: RSS-133 EMI: ICES-003 SAR: RSS-102 RSS-132 - Cellular Telephones Employing New Technologies Operating in the Bands 824-849 MHz and 869-894 MHz RSS-133 - 2 GHz Personal Communications Services ICES-003: Digital Apparatus RSS-102 - Radio Frequency Exposure Compliance of Radio communication Apparatus (All Frequency Bands) A-Tick ­ only for HiLo3G-900 variant AS/ACIF S042. 1: Requirements for connection to an air interface of a AS/ACIF S042. 1 telecommunications network ­ Part 1 AS/ACIF S042. 3: Requirements for connection to an air interface of a AS/ACIF S042. 3 Telecommunications Network - Part 3: GSM Customer Equipment Requirements of quality IEC 60068-2 Environmental testing ISO TS 16959 Hilo3G module is manufactured in accordance with ISO TS 16959 in certified factory 1. 3 TERMS AND ABBREVIATION Analog to Digital Converter Coder-Decoder Calling Line Identification Presentation Connected Line Identification Presentation Calling Line Identification Restriction Connected Line Identification Restriction Clear To Send Circuit Switched Data Codec Scheme Digital Communications System Data Set Ready Data Terminal Ready Enhanced Data Rate for GSM Evolution Enhanced GSM Enhanced network selection Enhanced operator name string Electrostatic Discharge European Telecommunication Standard Global System for Mobile communication General Packet Radio Services High Speed Circuit Switched Data High Speed Downlink Packet Access Integrated Circuit or Industry Canada (depends on the context) Input / Output International Standards Organization International Telecommunication Union Joint Test Action Group kilobit per second Liquid Crystal Display Light Emitting Diode Megabit per second ADC CODEC CLIP COLP CLIR COLR CTS CSD CS DCS DSR DTR EDGE EGSM ENS EONS ESD ETS GSM GPRS HSCSD HSDPA IC I/O ISO ITU JTAG Kbps or kbit/s LCD LED Mbps or Mbit/s Note d'étude / Technical document : URD1­ OTL 5696. 1­ 004 / 72362 Edition 06 HILO 3G TECHNICAL SPECIFICATION 29/09/2011 - page 8/46 PBCCH PCB PCM PCS PWM RAM RF RI RMS RTS RX SIM SMS TBC TBD TX UART UMTS USB USSD Packet Broadcast Channel Printed Circuit Board Pulse Code Modulation Personal Communication System Pulse Width Modulation Random Access Memory Radio Frequency Ring Indication Root Mean Square Ready To Send Reception Subscriber Identification Module Short Message Service To Be Confirmed To Be Defined Transmission Universal Asynchronous Receiver and Transmitter Universal Mobile Telecommunications System Universal Serial Bus Unstructured Supplementary Service Data 1. 4 CONVENTIONS Throughout this document, DTE (Data Terminal equipment) indicates the equipment which masters and controls the module device HiLo 3G by sending AT commands via its serial interface. [. . . ] Signal PWON Pin N° 31 Description Low level active input signal to power up the module Note d'étude / Technical document : URD1­ OTL 5696. 1­ 004 / 72362 Edition 06 HILO 3G TECHNICAL SPECIFICATION 29/09/2011 - page 17/46 3. 7 RESET Pin N° 18 Description Low level active input signal to reset the module One reset input pin is available to reset the module in case of undesirable behavior. Signal RESET 3. 8 Signal ADC ADC Pin N° 17 Description Analog to digital converter input One ADC input pin is available to measure an external analog voltage through dedicated AT command. 3. 9 VBACKUP One VBackup pin is available to keep supplying the real time clock 32768 Hz in case of main battery loss. It is used to connect a backup battery coin cell or rechargeable backup battery or super cap. This pin is an input / output and can manage the charge function of the backup battery Signal VBACKUP Pin N° 30 Description Power supply for backup battery 3. 10 VGPIO This Voltage pin is the reference voltage for the internal digital I/O's it can be used as a power supply and also as a module power status (ON/OFF). VGPIO is high when the module starts and remains at this level until the module is OFF. Signal VGPIO Pin N° 10 Description Digital Power supply and power up status 3. 11 POWER SUPPLIES Power supplies pins : 4 for the VBAT and 4 for the GND. It is recommended to connect them all, in order to lower the power signal path serial resistance. Signal VBAT GND Pin N° 1, 2, 39, 40 3, 4, 37, 38 Description VBAT power input pins Ground pins Note d'étude / Technical document : URD1­ OTL 5696. 1­ 004 / 72362 Edition 06 HILO 3G TECHNICAL SPECIFICATION 29/09/2011 - page 18/46 3. 12 POWER MANAGEMENT 3. 12. 1 SLEEP MODES There are two kinds of sleep mode, the "off mode" and "stand-by" mode. They are described below. 3. 12. 1. 1 Off mode When the module is in off mode it can not receive any call, it can not receive any AT commands but can be awaken either by its internal clock using AT+CALA or using PWON signal [2]. To go to this mode use AT+*PSCPOF. 3. 12. 1. 2 Stand-by mode management There are three stand-by modes management: · AT+KSLEEP=0 In this mode the sleep state is controlled by the DTR and by the firmware - DTR = 1 - The module never goes to sleep mode - DTR = 0 - The module goes to sleep mode when it is ready and can not be awaken with an AT command. Remark: even in this mode it is possible to use DTR signal to go from data to command mode, however in this case DTR has to be toggled from 1 to 0 then from 0 to 1. · AT+KSLEEP=1 In this mode the sleep state is only controlled by the firmware. However to be sure to wake up the module the "0x00" character has to be sent. The main interest of the AT+KSLEEP=0 mode is to be able to forbid the sleep mode using the DTR signal. · AT+KSLEEP=2 In this mode the sleep state is never authorized what ever the DTR state. A detailed description of those modes is given in [3]. Here we gives the logical state, '1' means connected to the ground Note d'étude / Technical document : URD1­ OTL 5696. 1­ 004 / 72362 Edition 06 HILO 3G TECHNICAL SPECIFICATION 29/09/2011 - page 19/46 3. 12. 2 Power supply and power consumption The power supply input of VBAT ranges from 3. 2V to 4. 4V and 3. 7V is nominal. All measurements in communication mode are done at maximum RF power transmission (PCL max). Off mode Stand-by mode Paging rate 2 ­ connected to the network Stand-by mode Paging rate 5 ­ connected to the network Stand-by mode Paging rate 9 ­ connected to the network GSM900 / CSD mode ­ in GSM850(PCL=5) communication DCS / PCS(PCL=0) GPRS when transmitting GSM900 / GSM850 data (CS-4 Class 10 4DL, DCS / PCS 1UL) EDGE when transmitting GSM900 / GSM850 data (MCS-9, Class 10, DCS / PCS 4DL, 1UL) GPRS stand-by mode ­ 1 or 2 PDP context are open Current consumption during a burst UMTS Stand-by mode DRX=6 UMTS Stand-by mode DRX=9 UMTS data mode TX: Maximun power Channel: B1 : 9613, 9750, 9887 B2 : 9263, 9400, 9537 B8 : 2713, 2788, 2862 GSM900 / GSM850 DCS / PCS All band All band 1. 3mA Typ. 50 µA 2. 8mA 1. 7mA 1. 4mA 260mA 180mA 600mA 520mA 310mA 310mA 2. 8 mA 1. 7 mA 1. 4mA 260 mA 180 mA 600 mA 520 mA 310 mA 310 mA 25° C Max 100 µA 3 mA 1. 9 mA 1. 6 mA 290 mA 200 mA 750 mA 610 mA 430 mA 340 mA 3. 1mA 2. 0mA 1. 8mA 280mA 200mA 650mA 550mA 330mA 320mA +85° C Typ. The HiLo 3G behavior in GPRS stand-by mode is similar to GSM stand-by mode. The power consumption also depends on DRX and on other network setting (number of adjacent cells, etc. ), it is between 1. 4 mA and 2. 8 mA. 1. 95A 1. 72A 1. 32A 1. 4A 2. 6 mA 1. 3 mA 1. 4A 3 mA 1. 5 mA 1. 4mA 1. 4A All band 600 600 mA 690 mA 650 A burst transmission happens in Standby, communication and GPRS mode. This measurement is performed with a 22 µF capacitor on the power supply path required to remove the overshoot. Note d'étude / Technical document : URD1­ OTL 5696. 1­ 004 / 72362 Edition 06 HILO 3G TECHNICAL SPECIFICATION 29/09/2011 - page 20/46 Figure 6: typical GPRS burst in the GSM900 frequency band 3. 12. 3 VGPIO This +2. 8V supply output is available on external pin of the module and can supply +2. 9V external components. The current capability for 2. 9V output is: - 290mA in active mode 3. 12. 4 VBACKUP In order to keep the internal Real Time Clock available, a VBACKUP input is present on the module interface. [. . . ] PCL (dBm) Frequency error (Hz) Phase error RMS (degree) DCS -40 29. 1 70 3 +85 28. 1 70 3 PCS -40 28. 7 70 3 +85 27. 7 70 3 min 26. 5 -180 - ETSI value max 30. 5 180 5° 6. 3 OUT OF OPERATIONAL RANGE (To be updated) No operation is guaranteed by Sagemcom out of the extended range. However, it has been observed on several modules: Temperature range -50° to -40° and +85° to 125° C C C C 125°C to 150° C T = 150° C T < -50° and T > 150°C C Comments TBD TBD TBD TBD Note d'étude / Technical document : URD1­ OTL 5696. 1­ 004 / 72362 Edition 06 HILO 3G TECHNICAL SPECIFICATION 29/09/2011 - page 36/46 7. ESD Using human body model from JEDEC JESD 22-A114 standard, the HiLo 3G can stand for +/-2kV ESD on all pins of the 40 points connector and on the RF connector. Note d'étude / Technical document : URD1­ OTL 5696. 1­ 004 / 72362 Edition 06 HILO 3G TECHNICAL SPECIFICATION 29/09/2011 - page 37/46 8. MECHANICAL SPECIFICATION 8. 1 PHYSICAL DIMENSIONS Whole size: 27 x 27 x 4. 8 mm Figure 9: HiLo 3G interface Note d'étude / Technical document : URD1­ OTL 5696. 1­ 004 / 72362 Edition 06 HILO 3G TECHNICAL SPECIFICATION 29/09/2011 - page 38/46 Figure 10: HiLo 3G dimensions Note d'étude / Technical document : URD1­ OTL 5696. 1­ 004 / 72362 Edition 06 HILO 3G TECHNICAL SPECIFICATION 29/09/2011 - page 39/46 8. 2 ASSEMBLY Shield frame is soldered on HiLo 3G PCB; Shield cover is assembled with shield frame and removable. The recommended solution to fix the HiLo 3G module is to manually solder the three mounting pins on the motherboard. The solder pad geometries for the mounting pins are given in Figure 14. [. . . ]

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