User manual CADENCE DESIGN SYSTEMS QRC EXTRACTION DATASHEET

[. . . ] CAD E N CE Q R C E XT R ACT I O N Multi corner / Statistical Distributed processing DATASHEET CadenCe QRC extRaCtion As advanced process geometries become more popular, parasitic extraction becomes a necessity not only during the validation phase but also during design implementation. Cadence QRC Extraction is an integrated extraction solution for design implementation and validation at 90nm and below. [. . . ] Integrated with the Encounter design environment, QRC Extraction provides seamless solutions for timing, IR, and EM analysis, signal integrity analysis, and power verification. It can output distributed or lumped, and coupled or decoupled RC data. Integrated with Encounter technology (Figure 2), QRC Extraction allows designers to reduce design turnaround time dramatically by performing incremental extraction, and to reach timing closure faster by utilizing signoffaccurate extraction data for timing and noise optimization. chip performance and yield. Built on a foundation of patented algorithms and proprietary extraction technologies, QRC Extraction brings the physics of interconnect parasitics into the Virtuoso environment for designing, characterizing, and optimizing chip layouts. Seamless integration with Virtuoso technology enables designers to perform parasitic extraction, backannotation, cross-probing, re-simulation, and analysis within a single design environment for increased productivity. QRC Extraction provides silicon-accurate resistance (R) and capacitance (C) interconnect parasitic extraction for all process technologies for transistor-level designs including RF, analog, mixed signal, custom, and memory. It provides highly accurate parasitics of both dense and sparse layouts for circuit simulation and analysis. As shown in Figure 3, QRC Extraction integrates with Cadence layout-vs. -schematic verification technologies (Cadence Assura® LVS, Cadence Physical Verification System, Mentor Graphics Calibre) and simulation technologies (Virtuoso Spectre® Circuit Simulator, Virtuoso Spectre RF Simulation Option, Virtuoso UltraSim Full-Chip Simulator). tRanSiStoR-level extRaCtion An integral part of the silicon analysis function inside the Virtuoso custom design environment, QRC Extraction supplies the critical parasitic information for optimizing www. ca de nce . com CA D ENC E Q RC EXTRAC TI O N 2 MUlti-CoRneR extRaCtion In designs at 130nm and below, a nominal corner extraction and some added margin is no longer sufficient to accurately predict parasitic effects. For example, signal integrity issues can occur at strong, high-temperature conditions. Thus, designers are required to perform extraction at multiple corners, and the number of corners grows as the process geometryshrinks. QRCExtractioncan extract multiple corners at once while significantly reducing overall runtime. GDSII DFII OA Cadence Physical Verification Cadence QRC Extraction StatiStiCal extRaCtion QRC Extraction offers statistical capability to efficiently reduce overall extraction runtimes whileprovidingaccurateresults. Ittakesinto account random variations of parameters likewidth, thickness, dielectricheight, metal resistivity, dielectric constant, via resistance, and temperature. Statistical extraction can significantly reduce extraction runtimes, especially at advanced process nodes. Drawn Devices Substrate R and C RLCK DFII/OA DSPF SPEF diStRiBUted pRoCeSSing QRC Extraction offers a distributed processing capability to efficiently extract multimillion-gate chips. It partitions the extractiontaskintomultipleindependent tasksthatcanbeexecutedinparallel using multiple CPUs and/or machines. Distributed processing can significantly reduce extraction runtimes, especially during the final signoff stages. Virtuoso Simulation and Analysis Figure 3: Complete transistor-level RLCK extraction advanCed SUBStRate Modeling CapaBility RF designers need a tool that not only extracts parasitic inductance accurately, but also evaluates the impact of substrate parasitics on their designs. Substrate noise coupling is a growing concern due to higher frequencies, higher integration, smaller feature sizes, and lower supply voltages. [. . . ] Cadence, assura, encounter, Spectre, virtuoso, and voltageStorm are registered trademarks and the Cadence logo and SoC encounter are trademarks of Cadence design Systems, inc. all others are properties of their respective holders. [. . . ]