User manual HP COMPAQ DX7200 SLIM TOWER PC TESTING ON BUSINESS DESKTOP PCS

[. . . ] Testing on HP Business Desktop PCs Introduction. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 Importance of Desktop Testing. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 Test Tool Development. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Hardware Evaluation Test Development . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . [. . . ] This helps mitigate risk by providing needed checks and balances and it helps to ensure a high HP standard of quality. These tests include, but are not limited to: System Board Validation Testing This testing focuses on the signal quality of high-speed interfaces, power delivery to system components, and ACPI power management. The System board is put through stress testing to help ensure that it will operate normally while running a variety of applications. Testing includes: · Signal Integrity Testing--This helps ensure proper signal quality on all major interfaces on the system board including front-side bus, memory bus, system clocks, USB (universal serial bus), SATA, and PCI / PCI Express buses. · Voltage Integrity Testing--This helps ensure that voltage regulators on the system board and in the power supply remain within HP Business Desktop specifications while running stress level testing. Additionally, voltage stress testing is conducted and measured on the various supported memory and processor configurations. · Power Management Testing--This helps ensure that the system will go into and come out of all supported low-power states including S1, S3, S4, and S5. Additionally, power cycle testing is conducted to simulate many years worth of power-up/power-down usage with a minimum of 10, 000 consecutive no-fail cycles. · Fan control--This helps ensure that the system fan(s) runs at required minimum thermal and acoustic levels for customers' needs. Platform Validation Testing This testing focuses on chipset validation, new architectural chipset features, the system board, processor, system memory, system BIOS, and system-level hardware interoperability to help ensure platform component stability prior to incorporation into an integrated desktop solution. Testing includes: · System BIOS Testing--This is comprehensive validation and qualification of the system BIOS. Testing includes BIOS calls and functionality, supported BIOS features, and expected BIOS interoperability with the platform hardware and software. · System Board--This is comprehensive validation and qualification of the system board (PCB/PCA) including testing of the chipset functionality/feature set, subsystem (i. e. , CPU, Memory, Graphics, Audio, PCI/PCIE, NIC, USB, IDE, LPC, etc. ), and associated hardware components. 4 · Processor Qualification--This is comprehensive validation and qualification of each unique processor, including all processor frequency changes and all processor stepping changes. Processor qualifications are executed on all supported platforms. · System Memory Qualification--This is comprehensive validation and qualification of each unique memory module. System memory module qualifications are executed on each supported platform. Mechanical Validation Testing This testing focuses on environmental and Industrial Design factors for the chassis, power supply, and system board. Mechanical testing includes form, fit and function tests; paint finish; durability tests; and security tests to help ensure that the product can be assembled correctly. Additional testing includes: · Shock and Vibration Testing--Units are subjected to random vibration and shock to help ensure that the system functions correctly in harsh environments. · Packaging Testing--Boxed systems are subjected to resonance, random vibration, and multiple drops from various heights to help ensure that the packaging can withstand rough handling and protect the system. · Thermal Testing--Each system board, power supply, and integrated subsystem (memory, graphics, audio, NIC, etc. ) is tested in elevated ambient, maximum power, and minimum power situations to help ensure that no component temperature specifications are exceeded. · Environmental Testing--Testing is conducted at various temperatures, altitudes, and humidity settings for extended periods of time to help ensure that the system design is reliable in many environments. · Electro-Magnetic Conductance Testing--This testing helps ensure that a module is not susceptible to and does not emit interfering radio waves. · Power Management Testing--This testing helps ensure that a module goes properly into and out of defined low-power states. [. . . ] Additional or different Linux providers may be supported on future products. Testing is conducted prior to submission using available industry tools and utilities with the goal of helping to ensure a passing Linux configuration. · Novell Testing and Certification--Select HP Business PCs are submitted for certification for use with the Novell Netware Client. Tested Configurations With the multitude of components included in a PC, and the number of operating systems, applications, and options offered, testing of every permutation becomes impossible. However, using disciplined test-engineering methods, HP helps ensure good test coverage. [. . . ]