User manual INTEL CELERON PROCESSOR E3000 THERMAL AND MECHANICAL DESIGN GUIDELINES

[. . . ] Intel® CoreTM2 Duo Processor E8000 and E7000 Series, Intel® Pentium® Dual-Core Processor E6000 and E5000 Series, and Intel® Celeron® Processor E3000 Series Thermal and Mechanical Design Guidelines August 2010 Document Number: 318734-016 THIS DOCUMENT AND RELATED MATERIALS AND INFORMATION ARE PROVIDED "AS IS" WITH NO WARRANTIES, EXPRESS OR IMPLIED, INCLUDING BUT NOT LIMITED TO ANY IMPLIED WARRANTY OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE, NON-INFRINGEMENT OF INTELLECTUAL PROPERTY RIGHTS, OR ANY WARRANTY OTHERWISE ARISING OUT OF ANY PROPOSAL, SPECIFICATION, OR SAMPLE. INTEL ASSUMES NO RESPONSIBILITY FOR ANY ERRORS CONTAINED IN THIS DOCUMENT AND HAS NO LIABILITIES OR OBLIGATIONS FOR ANY DAMAGES ARISING FROM OR IN CONNECTION WITH THE USE OF THIS DOCUMENT. Intel products are not intended for use in medical, life saving, life sustaining, critical control or safety systems, or in nuclear facility applications. Intel Corporation may have patents or pending patent applications, trademarks, copyrights, or other intellectual property rights that relate to the presented subject matter. [. . . ] The Thermal Control Circuit is enabled by the BIOS setting a bit in an MSR (model specific register). Enabling the Thermal Control Circuit allows the processor to attempt to maintain a safe operating temperature without the need for special software drivers or interrupt handling routines. When the Thermal Control Circuit has been enabled, processor power consumption will be reduced after the thermal sensor detects a high temperature (that is, PROCHOT# assertion). The Thermal Control Circuit and PROCHOT# transitions to inactive once the temperature has been reduced below the thermal trip point, although a small time-based hysteresis has been included to prevent multiple PROCHOT# transitions around the trip point. External hardware can monitor PROCHOT# and generate an interrupt whenever there is a transition from active-to-inactive or inactive-to-active. PROCHOT# can also be configured to generate an internal interrupt which would initiate an OEM supplied interrupt service routine. 34 Thermal and Mechanical Design Guidelines Thermal Management Logic and Thermal Monitor Feature Regardless of the configuration selected, PROCHOT# will always indicate the thermal status of the processor. The power reduction mechanism of thermal monitor can also be activated manually using an "on-demand" mode. Refer to Section 4. 2. 5 for details on this feature. 4. 2. 5 On-Demand Mode For testing purposes, the thermal control circuit may also be activated by setting bits in the ACPI MSRs. The MSRs may be set based on a particular system event (such as, an interrupt generated after a system event), or may be set at any time through the operating system or custom driver control thus forcing the thermal control circuit on. This is referred to as "on-demand" mode. Activating the thermal control circuit may be useful for thermal solution investigations or for performance implication studies. When using the MSRs to activate the on-demand clock modulation feature, the duty cycle is configurable in steps of 12. 5%, from 12. 5% to 87. 5%. For any duty cycle, the maximum time period the clocks are disabled is ~3 µs. This time period is frequency dependent, and decreases as frequency increases. To achieve different duty cycles, the length of time that the clocks are disabled remains constant, and the time period that the clocks are enabled is adjusted to achieve the desired ratio. For example, if the clock disable period is 3 µs, and a duty cycle of ¼ (25%) is selected, the clock on time would be reduced to approximately 1 µs [on time (1 µs) ÷ total cycle time (3 + 1) µs = ¼ duty cycle]. Similarly, for a duty cycle of 7/8 (87. 5%), the clock on time would be extended to 21 µs [21 ÷ (21 + 3) = 7/8 duty cycle]. In a high temperature situation, if the thermal control circuit and ACPI MSRs (automatic and on-demand modes) are used simultaneously, the fixed duty cycle determined by automatic mode would take precedence. Note: On-demand mode cannot activate the power reduction mechanism of Thermal Monitor 2 4. 2. 6 System Considerations Intel requires the Thermal Monitor and Thermal Control Circuit to be enabled for all processors. The thermal control circuit is intended to protect against short term thermal excursions that exceed the capability of a well designed processor thermal solution. Thermal Monitor should not be relied upon to compensate for a thermal solution that does not meet the thermal profile up to the thermal design power (TDP). Each application program has its own unique power profile, although the profile has some variability due to loop decisions, I/O activity and interrupts. In general, compute intensive applications with a high cache hit rate dissipate more processor power than applications that are I/O intensive or have low cache hit rates. [. . . ] NO C85609 SHT. 2 REV 0 H 135 G 7. 31 [ . 288 ] 2X R0. 5 [ . 020 ] G 1. 65 [ . 065 ] F 5. 3 [ . 209 ] R0. 3 TYP [ . 012 ] 1. 06 [ . 042 ] 45 X 0. 45 0. 05 [ . 018 . 001 ] 8 F 2X R3. 6 [ . 142 ] SECTION D-D SCALE 8 AB AB E 7. 35 [ . 289 ] 0. 1 [. 003] 0. 2 [. 007] BOUNDARY 7 E D DETAIL A SCALE 10 TYPICAL 4 PLACES W 0. 4 [. 015] 0. 5 [. 019] X 4X AB AB D C THIS POINT CORRESPONDS TO THE 39. 6 DIMENSION ON SHEET 1 ZONE A7 45 X 0. 25 0. 05 [ . 010 . 001 ] 8 DETAIL C SCALE 10 TYP 4 PLACES X R1. 4 [ . 055 ] 133. 59 C B DETAIL B SCALE 20 B W A 8 7 6 R3. 1 [ . 122 ] 2. 97 [ . 117 ] DEPARTMENT R CORP. TMD 2200 MISSION COLLEGE BLVD. BOX 58119 SANTA CLARA, CA 95052-8119 SIZE DRAWING NUMBER REV A A1 SCALE: C85609 1 DO NOT SCALE DRAWING SHEET 0 2 OF 2 5 4 3 2 1 Thermal and Mechanical Design Guidelines 119 Mechanical Drawings Figure 7-50. Reference Fastener - Sheet 1 120 Thermal and Mechanical Design Guidelines Mechanical Drawings Figure 7-51. Reference Fastener - Sheet 2 Thermal and Mechanical Design Guidelines 121 Mechanical Drawings Figure 7-52. [. . . ]