User manual INTEL CORE 2 DUO MOBILE THERMAL DESIGN GUIDE 6-2008

[. . . ] Intel® CoreTM 2 Duo Mobile Processors on 45-nm process for Embedded Applications Thermal Design Guide June 2008 Order Number: 320028-001 INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. EXCEPT AS PROVIDED IN INTEL'S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS, INTEL ASSUMES NO LIABILITY WHATSOEVER, AND INTEL DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY RELATING TO SALE AND/OR USE OF INTEL PRODUCTS, INCLUDING LIABILITY OR WARRANTIES RELATING TO FITNESS FOR A PARTICULAR PURPOSE, MERCHANTABILITY, OR INFRINGEMENT OF ANY PATENT, COPYRIGHT, OR OTHER INTELLECTUAL PROPERTY RIGHT. Intel Corporation may have patents or pending patent applications, trademarks, copyrights, or other intellectual property rights that relate to the presented subject matter. The furnishing of documents and other materials and information does not provide any license, express or implied, by estoppel or otherwise, to any such patents, trademarks, copyrights, or other intellectual property rights. [. . . ] The reference thermal solutions include z-stops machined into the base of the heatsink. The z-stops prevent the heatsink from inadvertently tilting when installed. Other methods are suitable including using electrically insulated gasket material at the base of the heatsink. 4. 3 Board Level Keep Out Zone Requirements A general description of the keep-out zones and mounting hole pattern for the reference thermal solutions are shown in Figure 2 and Figure 3. Detailed drawings for the PCB keep out zones are in Appendix B. Components placed between the underside of the heatsink and motherboard cannot exceed 4. 75 mm in height when using heatsinks that extend beyond the socket envelope shown in Figure 2 for the micro-FCPGA package. Intel® CoreTM 2 Duo Mobile Processors on 45-nm process-Thermal Design Guide TDG 11 June 2008 Order Number: 320028-001 Mechanical Specifications--CoreTM 2 Duo Mobile Processors Figure 2. Primary Side Keep Out Zone Requirements-- Micro-FCPGA Notes: 1. Dimension in millimeters [inches]. June 2008 Order Number: 320028-001 Intel® CoreTM 2 Duo Mobile Processors on 45-nm process for Embedded Applications TDG 12 CoreTM 2 Duo Mobile Processors--Mechanical Specifications Figure 3. Primary Side Keep Out Zone Requirements-- Micro-FCBGA Notes: 1. Dimension in millimeters [inches]. Intel® CoreTM 2 Duo Mobile Processors on 45-nm process-Thermal Design Guide TDG 13 June 2008 Order Number: 320028-001 Mechanical Specifications--CoreTM 2 Duo Mobile Processors Figure 4. Secondary Side Keep Out Zone Requirements Notes: 1. Dimension in millimeters [inches]. June 2008 Order Number: 320028-001 Intel® CoreTM 2 Duo Mobile Processors on 45-nm process for Embedded Applications TDG 14 CoreTM 2 Duo Mobile Processors--Thermal Solution Requirements 5. 0 5. 1 Thermal Solution Requirements Thermal Solution Characterization The thermal characterization parameter, ("psi"), is used to characterize thermal solution performance, as well as compare thermal solutions in identical situations (i. e. , heating source, local ambient conditions, etc. ). It is defined by the following equation: Equation 1. Junction-to-Local Ambient Thermal Characterization Parameter (JA) JA = TJ - TA TDP JA = Junction-to-local ambient thermal characterization parameter (°C/W) TJUNCTION MAX = Maximum allowed device temperature (°C) TA = Local ambient temperature near the device (°C) (see Section 7. 0, "Thermal Metrology" for measurement guidelines) TDP = Thermal Design Power (W) The thermal characterization parameter assumes that all package power dissipation is through the thermal solution (heatsink), and is equal to TDP. A small percentage of the die power (< 5%) is dissipated through the package/socket/motherboard stack to the environment, and should not be considered to be a means of thermal control. The junction-to-local ambient thermal characterization parameter, JA, is comprised of JS, which includes the thermal interface material thermal characterization parameter, and of SA, the sink-tolocal ambient thermal characterization parameter: Equation 2. Junction-to-Local Ambient Thermal Characterization Parameter JA = JS + SA Where: JS = Thermal characterization parameter from junction-to-sink, this also includes thermal resistance of the thermal interface material (TIM) (°C/W). SA = Thermal characterization parameter from sink-to-local ambient (°C/W) SA is a measure of the thermal characterization parameter from the bottom of the heatsink to the local ambient air. SA is dependent on the heatsink material, thermal conductivity, and geometry. It is also strongly dependent on the air velocity through the fins of the heatsink. Figure 5 illustrates the combination of the different thermal characterization parameters. Intel® CoreTM 2 Duo Mobile Processors on 45-nm process-Thermal Design Guide TDG 15 June 2008 Order Number: 320028-001 Thermal Solution Requirements--CoreTM 2 Duo Mobile Processors Figure 5. Processor Thermal Characterization Parameter Relationships TA HEATSINK TIM SA TS TJ TIM JA Device 5. 1. 1 Calculating the Required Thermal Performance for the Intel® CoreTM2 Duo processor Overall thermal performance, JA, is then defined using the thermal characterization parameter: · Define a target component temperature TJUNCTION and corresponding TDP. · Define a target local ambient temperature, TA. The following provides an illustration of how to determine the appropriate performance targets. Assume: · TDP = 35 W and TJUNCTION = 105 °C · Local processor ambient temperature, TA = 40 °C. Using Equation 1, the maximum allowable resistance, junction-to-ambient, is calculated as: Equation 3. Maximum Allowable Resistance JA = TJ - TA 105 - 40 = = 1. 857 o C / W TDP 35 To determine the required heatsink performance, a heatsink solution provider would need to determine CA performance for the selected TIM and mechanical load configuration. [. . . ] However, additional tests that include a solid barrier above the test motherboard surface can help evaluate the potential impact of the chassis. This barrier is typically clear Plexiglas*, extending at least 100 mm [4 in. ] in all directions beyond the edge of the thermal solution. Typical distance from the motherboard to the barrier is 81 mm [3. 2 in. ]. If a barrier is used, the thermocouple can be taped directly to the barrier with clear tape at the horizontal location as previously described, halfway between the fan hub and the fan housing. [. . . ]