User manual INTEL ICH8 MECHANICAL DESIGN GUIDE

[. . . ] R Intel® I/O Controller Hub 8 (ICH8) Family Thermal and Mechanical Design Guidelines -- For the Intel® I/O Controller Hub 8 (ICH8) Desktop Family. June 2006 Document Number: 313058-001 R THIS DOCUMENT AND RELATED MATERIALS AND INFORMATION ARE PROVIDED "AS IS" WITH NO WARRANTIES, EXPRESS OR IMPLIED, INCLUDING BUT NOT LIMITED TO ANY IMPLIED WARRANTY OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE, NON-INFRINGEMENT OF INTELLECTUAL PROPERTY RIGHTS, OR ANY WARRANTY OTHERWISE ARISING OUT OF ANY PROPOSAL, SPECIFICATION, OR SAMPLE. INTEL ASSUMES NO RESPONSIBILITY FOR ANY ERRORS CONTAINED IN THIS DOCUMENT AND HAS NO LIABILITIES OR OBLIGATIONS FOR ANY DAMAGES ARISING FROM OR IN CONNECTION WITH THE USE OF THIS DOCUMENT. Intel products are not intended for use in medical, life saving, life sustaining, critical control or safety systems, or in nuclear facility applications. Intel Corporation may have patents or pending patent applications, trademarks, copyrights, or other intellectual property rights that relate to the presented subject matter. [. . . ] These specifications are based on limited testing for design characterization. Loading limits are for the package only. 2. 3 Thermal Specifications To ensure proper operation and reliability of the ICH8 component, the case temperature TC must be at or below the maximum value TC-MAX specified in Table 2. If the temperature of the component exceeds the maximum temperature listed, system or component level thermal enhancements are required to dissipate the heat generated. The system designer must design a thermal solution for the ICH8 such that it maintains TC below TC-MAX for sustained power level equal to the Thermal Design power (TDP). Please note that the TC-MAX specification is a requirement for a sustained power level equal to TDP, and that the case temperature must be maintained at temperatures less than TC-MAX when operating at power levels less than TDP. This temperature compliance is to ensure chipset reliability over its useful life. Chapter 3 provides the thermal metrology guidelines for case temperature measurements. Chapter 4 provides information on the reference cooling solution for ATX systems. Intel's reference boundary conditions for ICH8 in an ATX system are 60 °C inlet ambient temperature and 0. 25m/s [50 lfm] of airflow. The ICH8 package will not require a heatsink when power dissipation is at or below 3. 0 W. This value is referred to as the Package Thermal Capability, or PTC. Note that the power level at which a heatsink is required will also change depending on system local operating ambient conditions and system configuration. For example, the local inlet Thermal and Mechanical Design Guidelines 9 Product Specifications R ambient air for the ICH8 component in a BTX system is projected to be approximately 55°C. For BTX platforms that have similar boundary conditions to what is stated above, ICH8 does not require a heatsink. Note that the local ambient air temperature for BTX is a projection based on anticipated power increases on a 2005 platform and are subject to change in the next revision of this document. When a heatsink is installed on the package, more power is now being pulled through the case. As a result the maximum case temperature must be maintained at lower level than without a heatsink to remain within specification. 10 Thermal and Mechanical Design Guidelines Product Specifications R 2. 4 Power Specifications The ICH8 component is estimated to dissipate the Thermal Design Power (TDP) value provided in Table 3. This TDP value is estimated based on various factors including: system configurations, industry stress applications, die temperature and part-to-part variance. Note that Table 3 reflects post silicon validated power numbers. Table 3. Intel® ICH8 Thermal Design Power Guidelines Configuration DMI x4 PCI PCI Express* LAN Configuration 1 X4 3 Two x1 s Configuration 2 X4 3 Two x1 s Gigabit LAN Connect Interface (GLCI) 2 1 Configuration 3 X4 3 Two x1 s GLCI Configuration 4 x4 3 One each x4 and x1 GLCI Devices SATA 4 8/2 Yes 4 4 8/2 Yes 3. 3 W 6 8/2 Yes 3. 7 W 6 8/2 Yes 4. 1 W USB (HS/FS) HD Audio Configuration Based Power NOTES: 1. 5. USB HS = USB 2. 0 High Speed Device (480 Mb/s), USB FS = USB 2. 0 Full Speed Device (12 Mb/s) 4 devices assume RAID 5 with 3 hard drives (3 Gb/s) and 1 optical drive (1. 5 Gb/s). 6 devices assumes RAID 5 with 4 hard drives (3 Gb/s) and 2 optical drives (1. 5 Gb/s) The number of devices refers to both the number of ports supported on the board as well as the quantity of devices attached. [. . . ] Note: The reference heatsink for the ICH8 is the same reference heatsink for the developed Intel® ICH6 which was also used for the Intel® ICH7. Refer to Figure 6 for reference ATX/ATX motherboard keep-out information. The heatsink can be tape-attached, or attached with a Z-clip. The motherboard keep-out allows for a Z-clip heatsink attach. [. . . ]