User manual LEICA DCM 3D BROCHURE

[. . . ] Sub-micron lateral resolution and a vertical resolution in the nm range is obtained in confocal mode, while large fields of view in combination with sub-nanometer Z resolution are acquired in the Interferometry mode. Characteristics of Confocal Profiling The Confocal mode of the Leica DCM 3D is used to measure the topography of very rough to smooth surfaces. Even fine surface structures become visible without touching the sample surface. Within seconds the sample is scanned vertically in pre-defined steps during which every point on the surface passes through the focus level. All image information that is out of focus is eliminated, and acquired confocal images are providing detailed information of the sample in high resolution and contrast in all three dimensions. [. . . ] The profiling algorithms produce a phase map of the surface, which is converted to the corresponding height map via an unwrapping procedure Double your advantages with Dual Core Benefit from the Dual Core Technology White light Optical Interferometric Profilers are often used because contact profilometers tend to be destructive to delicate surfaces and surface structures. Using the interferometry technology of the Leica DCM 3D subnanometer vertical resolutions are achieved, therefore even smoothest surfaces can be measured with high accuracy at an extreme speed. However in case of a measurement of rough surfaces the maximum slope that can be measured is limited by the comparably low numerical aperture (NA) of the interferometry objective. To allow the measurement even of steep slopes the Leica DCM 3D Dual Dore measuring microscope uses dedicated confocal objectives with an NA of up to 0. 95 and high light efficiency. This results in its ability to measure from moderate smooth up to rough surfaces with highest repeatability and more than 70º of local slope. Surface texture characterization is easy For quality control and production control e. g. of solar cells, the Leica DCM 3D confocal profiler can control within seconds the silicon surface texture, roughness, pyramid statistical characterization, and metal contact. Non-destructive 3D measurements of larger scanned regions are achieved in less than 10 seconds in comparison to lengthy time consuming measurements with conventional systems. The high local slope of a pyramid face requires the use of high NA objectives, which are mainly available with confocal technology. Typically a Leica objective with a magnification of 150× and an NA of 0. 95 is used. The surface is scanned a few microns along the focus position of the objective, collecting the confocal images plane by plane. The result is an image with infinite focus and 3D information about the pyramid heights, which can automatically integrate into pre-defined reports. See More of a Sample ­ The quality control of microelectronic components may require the measurement of a small section of the sample as well as a fast overview of a larger scanning area. In addition, maximizing the throughput of a production line is often a critical factor for success. Typically an objective with a high numerical aperture (NA) is related to higher magnification, which reduces the field of view to a few microns only. To overcome this limitation of conventional systems, the Leica DCM 3D features an ultra fast topography stitching. By using the highly efficient XY-stitching mode, sections of acquired 3D models are composed together ­ in an area far larger than a single field of view. The final surface data shows a seamless, highly precise model of a large surface area of the sample including the perfectly in focus texture while keeping the original properties of a single field. within a fraction of time Little or no maintenance and better results The Leica DCM 3D features vibration-free, long-lifetime scanning using microdisplay technology. Conventional confocal microscopes use movable mechanic parts inside scanning heads (scanning mirrors and spinning discs) that limit the instrument's lifetime, need a periodic re-adjustment to maintain optimum performance, and introduce mechanical vibrations that increase noise on the measurement. The Leica DCM 3D uses advanced microdisplay technology, a fast switching device with no moving parts inside that makes the scanning of confocal or interferometry images fast and stable with an extensive lifetime. The Leica DCM 3D is designed to be maintenance-free. Two high-power LEDs are integrated into the beam path, which provides a long average lifetime of 20, 000 hours in MTBF. A white light LED is used for color brightfield inspection, confocal images with real color texture, and VSI. [. . . ] Confocal, Interferometry (PSI, ePSI, VSI), Brightfield Color, Brightfield Greyscale (high resolution), Darkfield. from 2. 5× up to 150× in confocal from 5× up to 50× in interferometry 6-fold objective revolver manual / 6-fold objective revolver motorized Manual: 200 × 100 mm (others on request). Manual stitching available Motorized: From 114 × 75 mm to 302 × 302 mm (others on request). Leica Microsystems provide the best and most innovative imaging systems to see, measure, and analyze the microstructures in routine and research industrial applications, materials science, quality control, forensic science investigation, and educational applications. · Biosystems Division The Leica Microsystems Biosystems Division brings histopathology labs and researchers the highest-quality, most comprehensive product range. [. . . ]