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SAGEM HILO 3G TECHNICAL SPECIFICATION (911 ko)
Manual abstract: user guide SAGEM HILO 3GANNEXE 1
Detailed instructions for use are in the User's Guide.
[. . . ] MECHANICAL SPECIFICATION. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38 8. 1 PHYSICAL DIMENSIONS. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38 8. 2 ASSEMBLY . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40 8. 3 TERMINAL ASSIGNMENTS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42 8. 3. 1 Board to Board connection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42 8. 3. 2 Antenna connection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43 9. Smart cards; UICC-Terminal interface; 102230 Physical, electrical and logical test specification 3GPP TS 51. 010-4 : Mobile Station (MS) conformance specification; Part 4: Subscriber STK: 3GPP TS 51. 010-4 Identity Module (SIM) application toolkit conformance test specification 3GPP TS 31. 124 : Mobile Equipment (ME) conformance test specification; Universal USAT:3GPP TS 31. 124 Subscriber Interface Module Application Toolkit (USAT) conformance test specification
Note d'étude / Technical document : URD1 OTL 5696. 1 004 / 72362 Edition 06
HILO 3G TECHNICAL SPECIFICATION
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CE only for HiLo3G-900 variant RF: 2G EN301511 (refer to PTCRB/GCF RF report) RF: 3GEN301908-2 (refer to PTCRB/GCF RF report) ETSI EN 301 511 Global System for Mobile Communications (GSM); Harmonized EN for Mobile Stations in the GSM 900 and GSM 1800 Bands Covering Essential Requirements Under Article 3. 2 of the R&TTE Directive (1999/5/EC) ETSI EN 301 908-2 Electromagnetic compatibility and Radio spectrum Matters (ERM); Base Stations (BS), Repeaters and User Equipment (UE) for IMT-2000 ThirdGeneration cellular networks; Part 2: Harmonized EN for IMT-2000, CDMA Direct Spread (UTRA FDD) (UE) covering essential requirements of article 3. 2 of the R&TTE Directive EN 301908-1 Electromagnetic compatibility and Radio spectrum Matters (ERM) - Base Stations (BS), Repeaters and User Equipment (UE) for IMT-2000 Third-Generation cellular networks Part 1: Harmonized EN for IMT-2000, introduction and common requirements, covering essential requirements of article 3. 2 of the R&T ETSI EN 301 489-1 Electromagnetic compatibility and Radio spectrum Matters (ERM); ElectroMagnetic Compatibility (EMC) standard for radio equipment and services; Part 1: Common technical requirements ETSI EN 301 489-7 ElectroMagnetic Compatibility and Radio Spectrum Matters (ERM); ElectroMagnetic Compatibility (EMC) Standard for Radio Equipment and Services; Part 7: Specific Conditions for Mobile and Portable Radio and Ancillary Equipment of Digital Cellular Radio Telecommunications Systems (GSM and DCS) ETSI EN 301 489-24 Electromagnetic Compatibility and Radio Spectrum Matters (ERM); ElectroMagnetic Compatibility (EMC) Standard for Radio Equipment and Services; Part 24: Specific Conditions for IMT-2000 CDMA Direct Spread (UTRA) for Mobile and Portable (UE) Radio and Ancillary Equipment SAR (MPE) : EN62311 Safety: EN60950-1 EN 62311:2008 Assessment of electronic and electrical equipment related to human exposure restrictions for electromagnetic fields (0 Hz - 300 GHz) EN60950-1: Information technology equipment. General requirements
RF: 3G EN301908-1
EMC: EN301489-1, -7, 24
FCC RF : FCC Part 22H (850 FCC Part 22 Subpart H: Cellular Radiotelephone Service; MHz Band ) Subpart I: Offshore Radiotelephone Service; FCC Part 24E (for 1900 MHz Band) FCC Part 24 E: Personal Communications Service;Subpart E: Broadband PCS. EMI: FCC Part 15B SAR (MPE) : OET65C Subpart B - Radio frequency devices subpart B Unintentional Radiators
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IC RF 2G : RSS-132 RF 3G: RSS-133 EMI: ICES-003 SAR: RSS-102 RSS-132 - Cellular Telephones Employing New Technologies Operating in the Bands 824-849 MHz and 869-894 MHz RSS-133 - 2 GHz Personal Communications Services ICES-003: Digital Apparatus RSS-102 - Radio Frequency Exposure Compliance of Radio communication Apparatus (All Frequency Bands)
A-Tick only for HiLo3G-900 variant AS/ACIF S042. 1: Requirements for connection to an air interface of a AS/ACIF S042. 1 telecommunications network Part 1 AS/ACIF S042. 3: Requirements for connection to an air interface of a AS/ACIF S042. 3 Telecommunications Network - Part 3: GSM Customer Equipment
Requirements of quality IEC 60068-2 Environmental testing ISO TS 16959 Hilo3G module is manufactured in accordance with ISO TS 16959 in certified factory
1. 3
TERMS AND ABBREVIATION
Analog to Digital Converter Coder-Decoder Calling Line Identification Presentation Connected Line Identification Presentation Calling Line Identification Restriction Connected Line Identification Restriction Clear To Send Circuit Switched Data Codec Scheme Digital Communications System Data Set Ready Data Terminal Ready Enhanced Data Rate for GSM Evolution Enhanced GSM Enhanced network selection Enhanced operator name string Electrostatic Discharge European Telecommunication Standard Global System for Mobile communication General Packet Radio Services High Speed Circuit Switched Data High Speed Downlink Packet Access Integrated Circuit or Industry Canada (depends on the context) Input / Output International Standards Organization International Telecommunication Union Joint Test Action Group kilobit per second Liquid Crystal Display Light Emitting Diode Megabit per second
ADC CODEC CLIP COLP CLIR COLR CTS CSD CS DCS DSR DTR EDGE EGSM ENS EONS ESD ETS GSM GPRS HSCSD HSDPA IC I/O ISO ITU JTAG Kbps or kbit/s LCD LED Mbps or Mbit/s
Note d'étude / Technical document : URD1 OTL 5696. 1 004 / 72362 Edition 06
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PBCCH PCB PCM PCS PWM RAM RF RI RMS RTS RX SIM SMS TBC TBD TX UART UMTS USB USSD
Packet Broadcast Channel Printed Circuit Board Pulse Code Modulation Personal Communication System Pulse Width Modulation Random Access Memory Radio Frequency Ring Indication Root Mean Square Ready To Send Reception Subscriber Identification Module Short Message Service To Be Confirmed To Be Defined Transmission Universal Asynchronous Receiver and Transmitter Universal Mobile Telecommunications System Universal Serial Bus Unstructured Supplementary Service Data
1. 4
CONVENTIONS
Throughout this document, DTE (Data Terminal equipment) indicates the equipment which masters and controls the module device HiLo 3G by sending AT commands via its serial interface. [. . . ] It is used to connect a backup battery coin cell or rechargeable backup battery or super cap. This pin is an input / output and can manage the charge function of the backup battery Signal VBACKUP Pin N° 30 Description Power supply for backup battery
3. 10 VGPIO
This Voltage pin is the reference voltage for the internal digital I/O's it can be used as a power supply and also as a module power status (ON/OFF). VGPIO is high when the module starts and remains at this level until the module is OFF. Signal VGPIO Pin N° 10 Description Digital Power supply and power up status
3. 11 POWER SUPPLIES
Power supplies pins : 4 for the VBAT and 4 for the GND. It is recommended to connect them all, in order to lower the power signal path serial resistance. Signal VBAT GND Pin N° 1, 2, 39, 40 3, 4, 37, 38 Description VBAT power input pins Ground pins
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3. 12 POWER MANAGEMENT
3. 12. 1 SLEEP MODES
There are two kinds of sleep mode, the "off mode" and "stand-by" mode. They are described below.
3. 12. 1. 1
Off mode
When the module is in off mode it can not receive any call, it can not receive any AT commands but can be awaken either by its internal clock using AT+CALA or using PWON signal [2]. To go to this mode use AT+*PSCPOF.
3. 12. 1. 2
Stand-by mode management
There are three stand-by modes management: · AT+KSLEEP=0 In this mode the sleep state is controlled by the DTR and by the firmware - DTR = 1 - The module never goes to sleep mode - DTR = 0 - The module goes to sleep mode when it is ready and can not be awaken with an AT command. To wake up the module the user must toggle DTR to 1. Remark: even in this mode it is possible to use DTR signal to go from data to command mode, however in this case DTR has to be toggled from 1 to 0 then from 0 to 1. · AT+KSLEEP=1 In this mode the sleep state is only controlled by the firmware. The module goes to sleep mode when it is ready. The module may be awaken with any character received on the UART. However to be sure to wake up the module the "0x00" character has to be sent.
The main interest of the AT+KSLEEP=0 mode is to be able to forbid the sleep mode using the DTR signal. · AT+KSLEEP=2 In this mode the sleep state is never authorized what ever the DTR state.
A detailed description of those modes is given in [3].
Here we gives the logical state, '1' means connected to the ground
Note d'étude / Technical document : URD1 OTL 5696. 1 004 / 72362 Edition 06
HILO 3G TECHNICAL SPECIFICATION
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3. 12. 2 Power supply and power consumption
The power supply input of VBAT ranges from 3. 2V to 4. 4V and 3. 7V is nominal. All measurements in communication mode are done at maximum RF power transmission (PCL max). Off mode Stand-by mode Paging rate 2 connected to the network Stand-by mode Paging rate 5 connected to the network Stand-by mode Paging rate 9 connected to the network GSM900 / CSD mode in GSM850(PCL=5) communication DCS / PCS(PCL=0) GPRS when transmitting GSM900 / GSM850 data (CS-4 Class 10 4DL, DCS / PCS 1UL) EDGE when transmitting GSM900 / GSM850 data (MCS-9, Class 10, DCS / PCS 4DL, 1UL) GPRS stand-by mode 1 or 2 PDP context are open Current consumption during a burst UMTS Stand-by mode DRX=6 UMTS Stand-by mode DRX=9 UMTS data mode TX: Maximun power Channel: B1 : 9613, 9750, 9887 B2 : 9263, 9400, 9537 B8 : 2713, 2788, 2862 GSM900 / GSM850 DCS / PCS All band All band 1. 3mA Typ. 50 µA 2. 8mA 1. 7mA 1. 4mA 260mA 180mA 600mA 520mA 310mA 310mA 2. 8 mA 1. 7 mA 1. 4mA 260 mA 180 mA 600 mA 520 mA 310 mA 310 mA 25° C Max 100 µA 3 mA 1. 9 mA 1. 6 mA 290 mA 200 mA 750 mA 610 mA 430 mA 340 mA 3. 1mA 2. 0mA 1. 8mA 280mA 200mA 650mA 550mA 330mA 320mA +85° C Typ.
The HiLo 3G behavior in GPRS stand-by mode is similar to GSM stand-by mode. The power consumption also depends on DRX and on other network setting (number of adjacent cells, etc. ), it is between 1. 4 mA and 2. 8 mA. 1. 95A 1. 72A 1. 32A 1. 4A 2. 6 mA 1. 3 mA 1. 4A 3 mA 1. 5 mA 1. 4mA 1. 4A
All band
600
600 mA
690 mA
650
A burst transmission happens in Standby, communication and GPRS mode. This measurement is performed with a 22 µF capacitor on the power supply path required to remove the overshoot. Note d'étude / Technical document : URD1 OTL 5696. 1 004 / 72362 Edition 06
HILO 3G TECHNICAL SPECIFICATION
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Figure 6: typical GPRS burst in the GSM900 frequency band
3. 12. 3 VGPIO
This +2. 8V supply output is available on external pin of the module and can supply +2. 9V external components. [. . . ] However, it has been observed on several modules: Temperature range -50° to -40° and +85° to 125° C C C C 125°C to 150° C T = 150° C T < -50° and T > 150°C C Comments TBD TBD TBD TBD
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7.
ESD
Using human body model from JEDEC JESD 22-A114 standard, the HiLo 3G can stand for +/-2kV ESD on all pins of the 40 points connector and on the RF connector.
Note d'étude / Technical document : URD1 OTL 5696. 1 004 / 72362 Edition 06
HILO 3G TECHNICAL SPECIFICATION
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8.
MECHANICAL SPECIFICATION
8. 1 PHYSICAL DIMENSIONS Whole size: 27 x 27 x 4. 8 mm
Figure 9: HiLo 3G interface
Note d'étude / Technical document : URD1 OTL 5696. 1 004 / 72362 Edition 06
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Figure 10: HiLo 3G dimensions
Note d'étude / Technical document : URD1 OTL 5696. 1 004 / 72362 Edition 06
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8. 2
ASSEMBLY
Shield frame is soldered on HiLo 3G PCB; Shield cover is assembled with shield frame and removable. The recommended solution to fix the HiLo 3G module is to manually solder the three mounting pins on the motherboard. The solder pad geometries for the mounting pins are given in Figure 14. The assembly description of the module under the mother board is described in Figure 13.
Figure 11: HiLo 3G decomposition
Note d'étude / Technical document : URD1 OTL 5696. 1 004 / 72362 Edition 06
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Figure 12: HiLo 3G Assembly Geometry on mother board
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Figure 13: Spring contact assembly
8. 3
TERMINAL ASSIGNMENTS
8. 3. 1 Board to Board connection
A pair of 40-pin-connector connects HiLo 3G and DTE.
8. 3. 1. 1
HiLo 3G connector
Dimensions and references: Pins Number Reference 40 MOLEX 53885-0401
Dimension mm
A 11. 45
B 9. 5
C 10. 55
Figure 14:HiLo 3G connector drawing Note d'étude / Technical document : URD1 OTL 5696. 1 004 / 72362 Edition 06
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8. 3. 1. 2
Mother board connector
Dimensions and reference of one connector : Pin Number References 40 MOLEX 54102-0403 The reference of a reel of connectors is MOLEX 54102-0404. [. . . ]
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